PT. Yoshikawa Electronics Bintan |
We provide Surface Mount, COB & PCB Assembly Services. With our strong technology
know-how from our years of experience in Semiconductor Assembly Business,
We can also assemble Chip LED’s.
At Assembly area, we have Wafer Dicing, Dice Bonding, Wire Bonding and
Wire Inspection process. Also, we are able to seal dice and wire using liquid resin (Potting/Under fill). After assemble, proceed to SMT process to mount the components.
PT. Yoshikawa Electronics Bintan
Lot 18, Bintan Industrial Estate, Lobam Bintan 29152
Fax :+62-770-696300
Email : hrd@yeb.co.id